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              1. 咨询热线:

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                Product Information

                The quality (purity) of the solder alloys is critical for a successful welding. Too high, not purity in an alloy will negatively affect the formation of the solder joints, and ultimately affect the quality and reliability of solder joints. J-STD-006 is one of the three files on welding materials, and the remaining two requirements of J-STD-004 "welding flux and J-STD-005" solder paste requirements.

                The solder alloy key words are defined as follows:

                Alloys: composition, consisting of two or more chemical elements in which at least one is a metallic element, with the substance of the metallic properties.

                Base metal: the solder wetting of the metal surface. The surface of the base metal during welding is not necessary to melt.

                Eutectic: from the solid state to the liquid state change without passing through the plastic stage of an alloy. It is also for any given lowest melting temperature of the alloy. For example, the eutectic tin-lead solder alloy having a single melting temperature of 183 ° C (361 ° F).

                Flux: a chemical active compound by removing oxides and other contaminants, to prepare the metal surfaces to be welded. It also prevents the metal surface is oxidized again, until the welding is completed.

                Liquid phase: solder alloys the temperature of the transition to the liquid form from a solid or pasty.

                Solder: lower than 500 ° C (932 ° F) molten metal alloy.

                Solid phase: solder alloys transition from a liquid or paste form to a solid temperature.

                Moist: a relatively uniform, smooth, and without interruption, and the adhesion of the solder film is formed in the surface of the base metal.

                J-STD-006, covering a variety of forms solder, tin, tin wire, tin with tin powder and special solder (ie tin electrode, tin ingots, end hooked a small tin ball preformed etc.). Tin the article and tin powder usually no flux, solder wire, tin with special solder may not flux, flux, flux coverage sandwich or sandwich with coverage combined.

                The name of the alloy containing a main element (i.e., tin, lead, silver, etc.) and their quantities, percentages. For example, eutectic tin / lead solder by Sn63/Pb37 representatives. This means that the alloy contains 63% tin and 37% lead. The short name of the alloy is usually used to specify the solder alloy. As described in J-STD-006, alloy name contains five characters, defined by the following rules:

                Two letters on behalf of the main elements in the alloy chemical symbol. Section 6.4 of J-STD-006 contains special rules for selection of key elements.
                The two digits provisions percentage of the key elements in the alloy.
                Single letter variable allows the alloy purity.
                For example, 63 Sn/37 Pb short name Sn63. Other common examples include Sn60/Pb40, short name Sn60; Sn62/Pb36/Ag02, short name Sn62.

                A main element in the alloy (tin and lead) is undoubtedly hoped, and any other elements apparently considered impure. The solder alloy must be a homogenous mixture of the major elements of each particle (i.e., tin powder) are of the same alloy. Generally, to eliminate all impurities in a technically and economically feasible, but the quantity of impurities must be maintained at or below the specified level. Each of the number of elements in an alloy can be determined by any standard analytical methods. Impure elements, in terms of quality, will not exceed the following values ​​(alloy suffix A, B, C, or E):

                                                                                             The upper limit of the trace metals in the alloy

                Ag(银)

                Al(铝)

                As(砷)

                Au(金)

                Bi(铋)

                Cd(镉)

                Cu(铜)

                Fe(铁)

                0.100

                0.005

                0.030

                0.050

                0.100

                0.002

                0.080

                0.020

                In(铟)

                Ni(镍)

                Pb(铅)

                Sn(锡)

                Zn(锌)

                Sb(锑)A合金

                Sb(锑)B合金

                Sb(锑)C合金

                0.100

                0.010

                0.200

                0.250

                0.003

                0.500

                0.200

                0.050

                By the D suffix alloy ultrapure alloy, application for accessibility chip mounting. In these alloys, the number of binding not purity, quality, and will not be more than 0.05. For alloys having the E suffix, the quality, the quantity of Pb is not more than 0.10, and Sb of not more than 0.20.Recycled materials can and should be used; However, it must conform to the raw materials used in the same purity standards.

                Once Add a small amount (0.2-0.5%) of Sb​​, Pb based solder, in order to prevent the tin pest (tin pest) (ultrapure tin in a very low temperature, from the form of a metal into a white powder). However, this requirement has been canceled, because studies have shown that small amounts of almost any other metal elements to produce the same results.

                When the requirements of low-temperature welding, using bismuth alloy. Unfortunately, the bismuth alloy usually show poor wetting characteristics, and has a high insulation characteristic.

                When the need welding gilded surface, indium alloy to provide a number of advantages. However, the low temperature of 120 ° C soldering should not be more than too long. When the indium alloy exposed to the conditions of high temperature, high humidity or salt should consider conformal coating or hermetically sealed.

                The silver alloy is usually used together, with the elements (i.e. capacitors) containing silver plating in order to prevent precipitation of the operation of the reflow soldering of the silver plating layer.

                J-STD-006, there are many useful forms, including:

                Table 2 flux type and calibration symbol
                Table IV standards solder powder
                Table A-1 solder alloy composition, short name and temperature characteristics
                Table A-2 alloy names with solid and liquid temperature control table
                Table A-3 alloy short name and table name alloy
                Explain the eight test in J-STD-006:

                Solder powder particle size distribution - the screening method of the type 1-4
                Solder powder particle size distribution - measuring microscope method
                Solder powder particle size distribution - optical image analysis
                The decision of the maximum particle size of the solder powder,
                On the flux coverage or flux sandwich solder / flux percentage
                Dryness of the flux residue
                Splashes of flux the sandwich tin-line
                The solder pool of test

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